ARPA-E Energy Innovation Summit 2023

At the end of March, we attended the ARPA-E Energy Innovation Summit in National Harbor, MD. At the Summit we presented our work on power electronics tailored for fusion systems under an ARPA-E GAMOW grant. It was a great experience to network with many other awardees of ARPA-E grants working on innovative energy projects and learn about the power electronics needs of potential customers so we could design our boards to these specifications. Shown below is our Summit booth which was run by PFS Mike Paluszek and me.

Our booth contains prototype circuit boards developed by PSS and our collaborators at Princeton University (the Princeton Power Electronics Research Lab), along with flyers and other learning materials. The posters mounted behind us describe the work done by us and our collaborators: the Princeton Power Electronics Research Lab, UnitedSiC (now Qorvo), and the National Renewable Energy Laboratory (NREL).

Breakout sessions included panels on: future plans for inertial fusion energy, nuclear & materials, rethinking the nuclear waste challenge, and scaling up innovations for impact in the private sector with the ARPA-E SCALEUP program. Dr. Neil deGrasse Tyson gave a talk at the Summit!

The pdfs of the trifold and posters at our Summit booth are shown below. If you have any power electronics requirements for your systems, please contact us at!

ARPA-E Innovation Summit in Denver, CO

ARPA-E Summit held at Denver, CO.

It was exciting to meet and network with fusion industry and power electronics researchers, and influential leaders from both the private and public sectors at the Summit.

We displayed a prototype Class E amplifier, silicon carbide (SiC) JFET wafers, a PCB board of a load switch, and brochures of NREL.

Princeton Fusion Systems in collaboration with Princeton University, Qorvo, and NREL is developing integrated, power-dense, reliable, and scalable switching power amplifier boards for plasma heating and control applications. We presented the Class E prototype, some samples of the wide bandgap semiconductor silicon carbide (SiC) JFET wafers, and a PCB board for a load switch at our booth at the ARPA-E Summit. A previous post on our website has links to our marketing and technical documents.

The photos below show Stephanie Thomas and Sangeeta Vinoth at the Registration desk of the ARPA-E-2022-Summit.

The picture of the Class E prototype that the PFS presented at the booth has been added to the ARPA-E Innovation Summit website.

Class E prototype build by Princeton University

More pictures of the ARPA-E Summit can be found here.

The Summit helped us to understand the Fusion industry’s needs for power electronics. We design, test, and qualify circuit boards as building blocks for various applications: short pulses, control pulses, and RF amplifiers.

A key takeaway was that there was interest in SiC and GaN wide bandgap semiconductor requirements for high power and high frequency. Researchers asked about radiation-hardened electronics, and some were also interested in high voltage electronics.

There were talks at the Summit about climate change, rethinking solutions for resilience, reliability, and security of electric grid infrastructure, and decarbonization.